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The 30th International Workshop on Thermal Investigations of ICs and Systems seeks original, noncommercial papers describing research and innovations related to thermal and reliability issues in electronic components and systems. Authors are invited to submit an abstract describing recent work. Abstracts must detail the objectives of the work presented and demonstrate new results.

Conference Topics:

Thermal Phenomena in Simulation & Experiment:

  • Thermal management of electronic components and systems
  • Classical and modern thermometry and thermography
  • Thermal interface materials and their characterisation
  • Thermal modelling and investigation of packages
  • Nano-scale heat transfer
  • Multi-physics simulation and field coupling
  • Electro-thermal modelling and simulation
  • CFD modelling and benchmarking
  • Advanced thermal materials and technologies
  • Numerical methods for multi-scale heat transfer
  • Use of novel, advanced mathematics and statistics concepts / AI methods for complex digital twins of components and systems

Electronics Cooling Concepts & Applications:

  • Cooling concepts: air, liquid, 2-phase, etc. • Power electronics
  • High temperature electronics
  • Solid state lighting LED packages and LED based lighting solutions
  • Thermo-electric and sub-ambient cooling
  • Novel and advanced cooling technologies
  • Heat pipe and vapor chambers
  • 3D heterogenous integration and cooling, ultra-low form factor air cooling
  • Novel manufacturing methods
  • Cooling for IoT, CPS, mobile, edge computing
  • Thermal buffering for computational sprinting
  • Battery thermal management

      Thermo-Mechanical Reliability

      • Thermo-mechanical reliability
      • Prognostics and health monitoring
      • Lifetime modelling and prediction
      • Damage and fracture mechanics
      • Failure analysis and inline inspection

      Work targeting aeronautics and space will be particularly appreciated.

      Abstract Submission

      Please use the provided template for your abstract and upload it to the online conference system at www.conftool.pro/therminic2024.

      Download Template here

      Download Call for Papers

      Important Dates

      Deadline abstract submission extended to: April 22, 2024
      Notification of acceptance: June 13, 2024
      Submission of paper for workshop proceedings: August 7, 2024

      Proceedings

      Accepted contributions will be published in the conference proceedings and archived in IEEE Xplore (provided they comply with specifications). The papers can be searched through IEEE, Google scholar and other search engines.