Call for the Therminic Special Issue of Energies

(an open access journal of MDPI, ranked Q1 in engineering)
in the subject of thermal and reliability investigations in electronics components and systems

THERMINIC is the major European Workshop related to thermal and reliability issues in electronic components and systems. The subjects include multiphysics simulation and modelling, thermal, thermo-mechanical, and reliability-related measurements, thermal characterization, and lifetime prediction issues.

The selected papers will be published in the Special issue, due to be ready at the end of 2024, but the accepted and finalized papers will be published online immediately in Energies.

Energies is an open access journal of MDPI (approved by the “Norwegian” list; 2023 SCI ranking in engineering: Q1). The guest editors of the THERMINIC 2023 / 2024 Specia Issue of Energies are prof. Andras Poppe and prof. Marta Rencz. Additional information related to this special issue can be found at the publisher: www.mdpi.com/journal/energies/special_issues/42E30U2O6D

Information on the past THERMINIC Special Issue of Energies can be found here: www.mdpi.com/journal/energies/special_issues/thermal_management_characterization_electronics

prof.  A. Poppe and prof. M. Rencz